Layer |
Single
sided to 12 layers |
Thickness |
0.3mm(12mil)
(2L) to 3.5mm(138mil) |
Raw
Material |
FR4
(TG140-180) |
Copper
Foil Thickness |
0.3oz
(12um), 0.5oz (17.5um), 1oz (35um), 2oz (70um), 3oz (105um) |
Solder
Mask Type |
Liquid
Photo Imaginable, Silkscreen printing |
Surface
Treatment |
HAL(Pb/Pb
free), Immersion tin/silver/gold, Hard gold plating, ENTEK(OSP) |
Min.
Trace/Space |
0.1mm(4mil)/0.1mm(4mil) |
Min.
PTH Holes |
0.2mm(8mil)
finished |
Gold
Thickness |
Immersion
gold up to 10u"(0.25um), Gold fingers up to
30u"(0.75um) |
Outline
Finish |
CNC,
V-cut(continuous/discontinuous), Punch |
Other
Processes |
Carbon
ink, Peelable solder mask, Caped holes (solder mask or epoxy) |
Electrical
Test |
Fly
probe, Needle fixture |